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Tungsten Nitrido Complexes as Precursors for Low Temperature Chemical Vapor Deposition of WNxCy Films as Diffusion Barriers for Cu Metallization

K. Randall McClain, Christopher O’Donohue, Arijit Koley, Richard O. Bonsu, Khalil A. Abboud, Joseph C. Revelli, Timothy J. Anderson, and Lisa McElwee-White

J. Am. Chem. Soc. 2014, 136, 1650-1662

DOI: 10.1021/ja4117582